Theoretical studies of the additives for copper electroplating in PCB by DFT and MD simulations

作者：Wenjing Gao, Boyu Gao, Yaping Zhao, Y. Lu, Renhong Chen, Maozhong An, Anmin Liu · 发表于：New Journal of Chemistry · 年份：2025 · DOI：10.1039/d5nj02183a · 被引用次数：6 · 研究领域：Recycling and Waste Management Techniques

Electroplating additives were screened through quantum chemical calculations and molecular dynamic simulations.