Intel 18A Platform Technology Featuring RibbonFET (GAA) and PowerVia for Advanced High-Performance Computing

作者：K. Fischer, Frank E. Abboud, R. Aggarwal, P. Amin, Satyajit Anand, M. Asoro, C. Atay, C. Auth, Muratahan Aykol, A. Badmaev, B. Bains, K. Beckwitt, John Bell, M. Bellah, Dhananjay Bhawe, J. Birdsall, William T. Blanton, James O. Bondi, Anupama Bowonder, James D. Brooks, Markus J. Buehler, S. Burgess, K. Byon, D. Casillas, Supratik Chakraborty, Tuck-Boon Chan, S. Charue-bakker, Amitava Chatterjee, Steven Chin, C.J. Choi, D. A. Collins, D. Crum, Antoine Danon, Nilanjan Das, Rajib Das, A. Dhar, R. Ehlert, P. Elfick, G. Freeman, K. Ganesan, T. Ghani, Rony Ghostine, O. Golonzka, Barry R. Greene, Hannes Greve, W.M. Grimm, J. Guerrero, B. Guha, Zheng Guo, Pallav Gupta, W. Hafez, Conghui Han, D. Harris, M. Hattendorf, S. Havelia, J. Hicks, Irving T. Ho, Xielin Wang, Martin Horsch, Wei‐Ting Hsu, Lin Hu, S. Jaloviar, Andrew Jamieson, Arash Joushaghani, V. Kamysbayev, Eric Karl, S. Kelgeri, Annmarie Kelleher, A. Kim, Steven D. Kirby, Sabina Beranič Klopčič, J. Knudsen, S. Kobaku, M. Kobrinsky, H. Kothari, Daphne Lawrence, J. Leib, C-H. Lin, Chun-Yu Lin, Chou‐Ching K. Lin, Gokul Malyavanatham, Sumit K. Mandal, Sumit K. Mandal, S. Mani, B. Marinkovic, Akitomo Matsubayashi, Edward J. McKenna, R. Mehandru, J. Mehta, Neha Mehta, Stefan Meister, V. Mishra, K. Mistry, Adrian Moore, S. Mudanai, A. Murugavel, S. Natarajan, Se‐Bum Paik, Sashidhar S. Panchamgam, Daniel Pantuso, Ítala Paredes, K. Park, J.R. Parker, B. Parks, Rajesh Patel, S. Patil, Pabitra Kumar Paul, John Perkins, Leonard C. Pipes, C. Prasad, M. B. Prince, Conor Puls, Fahim ur Rahman, Saravanan Rajamani, R. Ramaswamy, S. Rossow, Ryan Russell, O. Saadat, O. Sabih, S Samant, Biswajit Sarkar, Daniel Schulman, Monika Sharma, Neelam Sharma, Hyun‐Woo Shim, Chandra Has Singh, Pankaj Sinha, Andrew J. Smith, S. Somaia, M. Sriram, Chad Staus, Joseph M. Steigerwald, J. Stoeger, Nathan Strutt, Cheng‐Yong Su, Atsushi Tanaka, Dipto G. Thakurta, D. J. Towner, M. Von Haartmann, Charles H. Wallace, Bin Wang, Chris Ward, M. Weybright, Tingzeng Wu, Guofeng Xu, Mange Ram Yadav, J. Zavestoski, Z. Zhang, Shan Zhou, B. Sell · 年份：2025 · DOI：10.23919/vlsitechnologyandcir65189.2025.11075006 · 被引用次数：21 · 研究领域：Parallel Computing and Optimization Techniques、Embedded Systems Design Techniques

An advanced Intel 18A technology featuring RibbonFET and PowerVia provides over 30% density scaling and a full node of performance improvement compared to Intel 3. Intel 18A achieved 18%/25% performance (0.75V/1.1V) at iso-power over Intel 3 through an industry-first combination and optimization of advanced interconnects, a Gate-All-Around (GAA) transistor architecture, backside power, and design co-optimization. Intel 18A offers high-performance (HP) and high-density (HD) libraries with full-featured technology design capabilities and enhanced design ease of use.