Reliability of Immersion Coolant and PCB Materials Evaluated Through Accelerated Thermal Testing

作者：Seung-Min Lee, Woo Jin Lee, Eugene N. Cho, Jinsoo Bae, Keunho Rhew, Yuchul Hwang, Seung‐Kyun Kang · 发表于：IEEE Transactions on Components Packaging and Manufacturing Technology · 年份：2025 · DOI：10.1109/tcpmt.2025.3594600 · 被引用次数：1 · 研究领域：Structural Analysis of Composite Materials、Engineering Applied Research、Heat Transfer and Numerical Methods

Immersion cooling, which utilizes inert dielectric fluids for data center cooling presents a promising solution to improve power usage effectiveness and thermal design power for cost effectiveness. However, the long-term reliability of immersion cooling systems, particularly the interactions of prolonged thermal stress on both the coolant and data server components remains underexplored. In this study, we aim to address the gap in long-term stability research for hydrocarbon-based immersion coolants by using high-temperature accelerated testing to evaluate both the immersion coolant’s stability and its effects on the immersed materials. Spectroscopic and thermal analyses reveal that the coolant undergoes accelerated oxidation at elevated temperature, while rheological measurements indicate significant deterioration linked to the oxidation degrees. These findings establish a framework for evaluating the long-term stability of immersion coolants and immersed devices, aiming to support the sustainable and reliable operation of data centers amidst growing computational demands.