CuCl as a Mg2+ reservoir for in situ interface layer engineering and highly stable Mg plating/stripping

作者：Yuanxiang Zhang, Tianlong Huang, Maosheng Cui, Xiaoxiao Wang, Zhen Mu, Mengting Yuan, Zilu Wei, Meng Yuan, Yanwei Sui, Jiqiu Qi, Yang Zhang, Xiaolan Xue · 发表于：Journal of Colloid and Interface Science · 年份：2025 · DOI：10.1016/j.jcis.2025.138508 · 被引用次数：4 · 研究领域：Advancements in Battery Materials、Semiconductor materials and devices、Copper Interconnects and Reliability