Tailoring the strength-conductivity combination in Cu matrix composites via in-situ TiB2 synthesis

作者：Yifan Yan, Yilin Qiu, Xi Zhang, Bao Wang, Rui Li, Haoran Wu, Wei Zheng, Weiyang Long, Guoshang Zhang, Zhiyuan Zhu, Pengfei Yue, Kexing Song · 发表于：Journal of Materials Research and Technology · 年份：2025 · DOI：10.1016/j.jmrt.2025.07.192 · 被引用次数：10 · 研究领域：Aluminum Alloys Composites Properties、Advanced ceramic materials synthesis、Microstructure and mechanical properties

Optimal interfacial bonding coupled with outstanding strengthening efficiency of reinforcement remains the cornerstone for developing high-performance Cu matrix composites. This study focuses on modulating both interface characteristics and microstructural architecture through in-situ processing, aiming to achieve a strength-conductivity balance in Cu matrix composites. Fabricated via direct current resistance sintering, the in situ TiB 2 /Cu composites exhibit increasing yield strength from 174 MPa to 388 MPa with increasing TiB 2 content, achieving a 155.9%-470.6% enhancement over pure Cu while maintaining room-temperature thermal conductivity exceeding 200 W/m·K. Notably, these in-situ composites achieve superior strength-conductivity synergy compared to both conventional Cu matrix composites and Cu alloys reported in existing literature. This is attributed to the in-situ process regulation achieving: semi-coherent interfacial bonding, grain refinement (98% refinement), dislocation strengthening (32.6-fold multiplication in dislocation density), and effective load transfer. Complementary mesomechanical simulations demonstrate that composite damage primarily originates from stress-strain concentration within the interparticle matrix regions, with matrix ductile fracture dominating the failure mode, and no significant interfacial debonding observed. These findings establish a theoretical framework for designing Cu matrix composites with exceptional strength-conductivity prop...