Influence of grinding-induced damage on scratching behavior and ductile-to-brittle transition of monocrystalline YAG wafers in ultraprecision grinding

作者：Jinxing Huang, Xingchen Guo, Zhigang Dong, Renke Kang, Shang Gao · 发表于：Tribology International · 年份：2025 · DOI：10.1016/j.triboint.2025.110946 · 被引用次数：5 · 研究领域：Advanced Surface Polishing Techniques、Advanced machining processes and optimization、Laser Material Processing Techniques