Bonding mechanism in Cu coating deposited on Al alloy substrate: Combining molecular dynamics simulation and experiment

作者：Ling Shao, Weiwei Li, Qingsong Lu, Na Xue, Yingwei Chen, Yincheng Wu, Chengqing Liu, Yizhe Liu, Khurram Sajjad, Qi Shi, Chenxiao Wang, J.W. Lv, Minghui Ye, Tao Zhou, Jiankang Huang, Liu Zhu · 发表于：Materials Science and Engineering A · 年份：2025 · DOI：10.1016/j.msea.2025.148703 · 被引用次数：41 · 研究领域：High-Temperature Coating Behaviors、Metal and Thin Film Mechanics、Copper Interconnects and Reliability