Molecular simulation study of the subsurface damage mechanism of silicon carbide/aluminum composites during laser-assisted grinding

作者：Tinghong Gao, Qi Li, Kejun Dong, Guiyang Liu, Wanjun Yan, Jin Huang, Han Song, Zhan zhang · 发表于：Physica B Condensed Matter · 年份：2025 · DOI：10.1016/j.physb.2025.417394 · 被引用次数：4 · 研究领域：Advanced Surface Polishing Techniques、Advanced machining processes and optimization、Advanced Machining and Optimization Techniques