Insight into the atomic-scale material removal of 4H-SiC electrochemical mechanical polishing (ECMP) using graphene oxide

作者：Zirui Wang, Yuguang Zhu, Ronghao Ren, Tianyu Zhang, Yang Peng, Yongguang Wang, Xiaolong Lu, C.M. Wang · 发表于：Tribology International · 年份：2025 · DOI：10.1016/j.triboint.2025.110803 · 被引用次数：14 · 研究领域：Advanced Surface Polishing Techniques、Diamond and Carbon-based Materials Research、Integrated Circuits and Semiconductor Failure Analysis