Exploration on functional groups of complexing agents during chemical mechanical polishing for Co interconnects

作者：Lifei Zhang, Xinchun Lu · 发表于：Journal of Materials Science · 年份：2025 · DOI：10.1007/s10853-025-10661-8 · 被引用次数：4 · 研究领域：Advanced Surface Polishing Techniques、Semiconductor materials and devices、Copper Interconnects and Reliability