Monodisperse SiO2 Spheres: Efficient Synthesis and Applications in Chemical Mechanical Polishing

作者：Jinlong Ge, Yu Cao, Hui Han, Xiaoqi Jin, Jing Liu, Yuhong Jiao, Qiuqin Wang, Yan Gao · 发表于：Nanomaterials · 年份：2025 · DOI：10.3390/nano15090665 · 被引用次数：6 · 研究领域：Advanced Surface Polishing Techniques、Diamond and Carbon-based Materials Research、Force Microscopy Techniques and Applications

The atomic level polishing of a material surface affects the accuracy of devices and the application of materials. Silica slurries play an important role in chemical mechanical polishing (CMP) by polishing the material surface. In this study, an efficient and controllable Stöber approach was developed to synthesize uniform monodisperse silica spheres with different cationic surfactants. The obtained silica spheres exhibited a regular shape with a particle size of 50–150 nm and were distributed evenly and narrowly. The highest surface specific area of the silica spheres was approximately 1155.9 m2/g, which was conducive to the polish process. The monodisperse SiO2 spheres were applied as abrasives in chemical mechanical polishing. The surface micrographs of silicon wafers during the CMP process were studied using atomic force microscopy (AFM). The results demonstrated that the surface roughness Ra values reduced from 1.07 nm to 0.979 nm and from 1.05 nm to 0.933 nm when using a CTAB-SiO2 microsphere as an abrasive. These results demonstrate the advantages of monodisperse SiO2 spheres as abrasive materials in chemical mechanical planarization processes.