A performance degradation and lifetime prediction model for thermoelectric device under thermal cycling

作者：Junhao Yan, Zeyu Liu, Zhijie Liu, Yujia Wang, Ding Wang, Limei Shen · 发表于：Applied Thermal Engineering · 年份：2025 · DOI：10.1016/j.applthermaleng.2025.126655 · 被引用次数：8 · 研究领域：Advanced Thermoelectric Materials and Devices、Electronic Packaging and Soldering Technologies、Thermal properties of materials