Effects of deposition temperature on microstructure and electrical resistivity of intrinsic CVD-SiC

作者：Jiabao Liu, Zhaofeng Chen, Pan Chai, Qiang Wan · 发表于：Ceramics International · 年份：2025 · DOI：10.1016/j.ceramint.2025.03.174 · 被引用次数：4 · 研究领域：Silicon Carbide Semiconductor Technologies、Semiconductor materials and devices、Copper Interconnects and Reliability