Unraveling the effect of Sn crystallographic orientation on electromigration-induced intermetallic compounds formations in Cu/Ni/SnAg/Ni/Cu microbumps

作者：Shih‐Chi Yang, Hao Su, K. N. Tu, Chih Chen · 发表于：Journal of Alloys and Compounds · 年份：2025 · DOI：10.1016/j.jallcom.2025.179631 · 被引用次数：10 · 研究领域：Electronic Packaging and Soldering Technologies、Copper Interconnects and Reliability、3D IC and TSV technologies