Thermal Contact Resistance and Heat Transfer Enhancement Mechanisms at Non-Smooth Contact Interfaces

作者：Yifan Wang, Xiaoxia Sun, Huifang Kang, Xinglong Ma, Tao Zhang · 发表于：Journal of Thermal Science · 年份：2025 · DOI：10.1007/s11630-025-2086-5 · 被引用次数：9 · 研究领域：Thermal properties of materials、Adhesion, Friction, and Surface Interactions、Electronic Packaging and Soldering Technologies