Filling performance of an Acid Blue 1 leveler on blind microvias

作者：Mingjie Li, Xuesong Peng, Jie Jiang, Yaqiang Li, Fan Meng, Youzheng Wu, Maozhong An, Ruopeng Li, Penghui Ren, Peixia Yang · 发表于：New Journal of Chemistry · 年份：2025 · DOI：10.1039/d4nj05470a · 被引用次数：11 · 研究领域：Biosensors and Analytical Detection

The void-free blind microvia copper electroplating process is a key technology in HDI PCB manufacturing.