Microstructure and properties of SnBiIn low-melting point solder doped with Ag particles

作者：Zheng Liu, Haodong Wu, Li Yang, Yaocheng Zhang, Yu Zhang, Yu Zhang, Yu Zhang, Yucong He · 发表于：Welding in the World · 年份：2025 · DOI：10.1007/s40194-024-01918-y · 被引用次数：6 · 研究领域：Electronic Packaging and Soldering Technologies、3D IC and TSV technologies、Intermetallics and Advanced Alloy Properties