Atomic layer deposition of nanofilms on porous polymer substrates: Strategies for success

作者：Brian C. Welch, Jeanne Casetta, Rajesh Pathak, Jeffrey W. Elam, Céline Pochat‐Bohatier, Philippe Miele, Tamar Segal‐Peretz · 发表于：Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 年份：2025 · DOI：10.1116/6.0004187 · 被引用次数：11 · 研究领域：Semiconductor materials and devices、Electronic and Structural Properties of Oxides、Diamond and Carbon-based Materials Research

Atomic layer deposition (ALD) is a versatile technique for engineering the surfaces of porous polymers, imbuing the flexible, high-surface-area substrates with inorganic and hybrid material properties. Previously reported enhancements include fouling resistance, electrical conductance, thermal stability, photocatalytic activity, hydrophilicity, and oleophilicity. However, there are many poorly understood phenomena that introduce challenges in applying ALD to porous polymers. In this paper, we address five common challenges and ways to overcome them: (1) entrapped precursor, (2) embrittlement, (3) film fracture, (4) deformation, and (5) pore collapse. These challenges are often interrelated and can exacerbate one another. To investigate these phenomena, we applied various ALD chemistries to porous polymers including polyethersulfone, polysulfone, polyvinylidene fluoride, and polycarbonate track-etched membranes. Reaction-diffusion modeling revealed why certain precursors and processing conditions result in embrittling subsurface material growth, entrapment of unreacted precursors, and nongrowth. We quantify the limits of ALD processing temperatures that are dictated by thermal expansion mismatch and can lead to fractured ALD films. The results herein allow us to make recommendations to avoid, mitigate, or overcome the difficulties encountered when performing ALD and plasma-enhanced ALD on porous polymers. We intend this article to serve as a “lessons learned” guide informed by...