Incorporating negative thermal expansion Cu2V2O7 into epoxy to achieve low thermal expansion and high thermal conductivity

作者：Jinguo Li, Feiyu Qin, Yuguang Lv, Xin Yang, Tianhang Wu, Xiao-Ling Wang, Wenhui Xu, Nianjie Liu, Jun Wang, Lei Hu, Jun Sun, Xiangdong Ding · 发表于：Journal of Alloys and Compounds · 年份：2025 · DOI：10.1016/j.jallcom.2025.178601 · 被引用次数：7 · 研究领域：Thermal Expansion and Ionic Conductivity、Advanced Battery Materials and Technologies、Ferroelectric and Piezoelectric Materials