Towards understanding the mechanisms of material removal and deformation in GaAs during nanomilling

作者：Jiqiang Wang, Yongda Yan, Hailong Cui, Shaoqin Liu, Chen Li, Yanquan Geng · 发表于：Journal of Materials Processing Technology · 年份：2025 · DOI：10.1016/j.jmatprotec.2025.118712 · 被引用次数：65 · 研究领域：Advanced Surface Polishing Techniques、Metal and Thin Film Mechanics、Integrated Circuits and Semiconductor Failure Analysis