Enhanced adhesion strength of copper deposited epoxy composite films for chip substrates by tuning copper oxide and internal stress

作者：Shanjun Ding, Xiao‐Meng Wu, Chuan Chen, Mengqi Gui, Peng Sun, Fang Yang, Xu Zhang, Zhidan Fang, Qidong Wang · 发表于：Applied Surface Science · 年份：2024 · DOI：10.1016/j.apsusc.2024.161911 · 被引用次数：13 · 研究领域：ZnO doping and properties、Copper Interconnects and Reliability、Copper-based nanomaterials and applications