A High Coupling Coefficient and Symmetric Transformer Based on TSV

作者：Yue Deng, Fengjuan Wang, Xiangkun Yin, Yuan Yang, Ningmei Yu, Yan Li · 发表于：IEEE Transactions on Components Packaging and Manufacturing Technology · 年份：2024 · DOI：10.1109/tcpmt.2024.3503561 · 被引用次数：25 · 研究领域：Photonic and Optical Devices、Semiconductor Lasers and Optical Devices、3D IC and TSV technologies

Transformers are the key passive devices in many radio frequency integrated circuit (RF IC) applications. In this article, a kind of ultrahigh coupling coefficient and symmetric transformer based on through-silicon via (TSV) is proposed. HFSS software is used to model and simulate the transformers with turn ratios of 1:1, 1:2, and 1:3, and the three structures are manufactured and measured. The measurement results show that the coupling coefficients of the three are 0.956, 0.971, and 0.954, and the areas are 0.007, 0.012, and 0.015 mm2. Compared with other literatures, it has the characteristics of high coupling and miniaturization.