Facile Construction of Hyperbranched Polyphenylsiloxane-Modified Epoxy Resins with Excellent Low Dielectric Properties for Electronic Packaging

作者：Junchen Wu, Xiaoheng Liang, Liang Yu, Yuxue Zhu, Qunchao Zhang, Wei Wu, Jun You, Dean Shi, Tao Jiang · 发表于：ACS Applied Polymer Materials · 年份：2024 · DOI：10.1021/acsapm.4c02745 · 被引用次数：22 · 研究领域：Synthesis and properties of polymers、Silicone and Siloxane Chemistry、Epoxy Resin Curing Processes

The booming development of next-generation communication technologies urgently requires high-performance electronic packaging materials with facile construction. Hereby, We first synthesized hyperbranched polysiloxane with phenyl, propyl, and hydroxyl groups as terminals. Subsequently, we incorporated it into bisphenol A epoxy resin using covalent cross-linking agents to cure it for electronic packaging applications. The manufactured DGEBA/HBPSi/MeTHPA resins not only had a lower curing temperature, which facilitates processing, but also exhibited significantly enhanced toughness, thereby increasing the usage limit of packaging materials. Differential scanning calorimetry (DSC) data were utilized to explore the nonisothermal curing behaviors of the system. The DSC thermogram exhibited distinct curing stages within the temperature range of 75–225 °C, and the average activation energies computed using the Kissinger and Ozawa methods were 68.42 and 71.73 kJ/mol, respectively. Additionally, dynamic mechanical analysis (DMA) and fracture morphology analysis demonstrated that the DGEBA/HBPSi/MeTHPA resin had excellent storage modulus, enabling it to better resist external impacts, and its fracture surface displays ductile fracture characteristics. Meanwhile, compared to the pure epoxy resins, the impact strength, flexural strength, and elongation at break were significantly increased by 153.85, 47.76, and 205.94%, respectively. Notably, the DGEBA/HBPSi/MeTHPA resins have excellent ...