A Novel Method for Online Junction Temperature Monitoring of Power Module Based on In-Situ Sensor Fabrication

作者：Ronghu Ke, Zhiyuan Hu, Jianfeng Tao, Zhuoqing Yang, Chengliang Liu · 发表于：IEEE Transactions on Power Electronics · 年份：2024 · DOI：10.1109/tpel.2024.3485997 · 被引用次数：6 · 研究领域：Advanced Sensor and Control Systems、Thermal Analysis in Power Transmission、Advanced Algorithms and Applications

Online monitoring of junction temperature ($T_{j}$) in power modules is crucial for enhancing the performance and reliability of systems. However, existing methods for$T_{j}$monitoring face several challenges, including device aging, lack of universality, and intrusive damage. To solve these difficulties, this study innovatively proposes a monitoring method based on the in-situ fabrication of temperature sensors. Sensors are directly fabricated between the chip and the upper copper layer of the direct bond copper board. This approach can apply to various chips demonstrating exceptional universality. It eliminates the need to open the case, with data transmission achieved through bonding wires. After that, the proposed method requires a low sampling rate and narrow range, thus allowing for cost-effective online monitoring. Furthermore, the article establishes a temperature differential model ($\Delta T$) caused by the difference between the sensor's actual in situ and theoretical locations. Through experimental validation, the sensor's steady-state characteristics, transient response, and effectiveness in online monitoring are confirmed. The results affirm that in-situ fabricated sensors achieve great performance in online$T_{j}$monitoring.