Simulation study on the effect of palladium layer thickness and temperature on the bonding properties of palladium coated copper wire

作者：Bin An, Hongliang Zhou, Jun Cao, Pingmei Ming, Jie Xia, Jingguang Yao, John Persic · 发表于：Microelectronics Reliability · 年份：2024 · DOI：10.1016/j.microrel.2024.115515 · 被引用次数：7 · 研究领域：Electronic Packaging and Soldering Technologies、3D IC and TSV technologies、Copper Interconnects and Reliability