Scholay

学术搜索 · AI 审稿 · LaTeX 协作

Silicon-based microjet array impingement boiling heat transfer with SDS surfactant solutions

作者:J. S. Liu, Huiying Wu, Xia Hua, Zhenyu Liu · 发表于:Applied Thermal Engineering · 年份:2024 · DOI:10.1016/j.applthermaleng.2024.124454 · 被引用次数:10 · 研究领域:Heat Transfer and Boiling Studies、Heat Transfer Mechanisms、Heat Transfer and Optimization