Roughness control in the processing of 2-inch polycrystalline diamond films on 4H-SiC wafers

作者：Xiufei Hu, Ziang Wang, Yingnan Wang, Saibin Han, Xiaoyu Zhang, Xiaoyu Zhang, Yan Peng, Lei Ge, Mingsheng Xu, Xiwei Wang, Jisheng Han, Xiangang Xu · 发表于：Materials Science in Semiconductor Processing · 年份：2024 · DOI：10.1016/j.mssp.2024.108824 · 被引用次数：12 · 研究领域：Diamond and Carbon-based Materials Research、Metal and Thin Film Mechanics、Advanced Surface Polishing Techniques