A new strategy for preparing high strength and high precision diffusion bonding GH536 joints via pulsed current and subsequent heat treatment

作者：Tong Wu, Yuyuan Liu, Qianrun Zhang, Ke Li, Rui Xu, Haohua He, Ce Wang, Panpan Lin, Xin Yue, Tiesong Lin, Peng He · 发表于：Journal of Manufacturing Processes · 年份：2024 · DOI：10.1016/j.jmapro.2024.08.028 · 被引用次数：12 · 研究领域：Electromagnetic Effects on Materials、Intermetallics and Advanced Alloy Properties、Metal Alloys Wear and Properties