Performance of thermo-compression bonding for HgCdTe based focal plane array

作者：Anand Singh, Vijay Singh Meena, R. Pal · 发表于：Microelectronics Reliability · 年份：2024 · DOI：10.1016/j.microrel.2024.115476 · 被引用次数：8 · 研究领域：Advanced Semiconductor Detectors and Materials、Infrared Target Detection Methodologies、CCD and CMOS Imaging Sensors