Improved thermal conductivity of high‐density polyethylene by incorporating hybrid fillers of copper powders and silicon carbide whiskers

作者：Gengchen Yang, Yao Li, Mei Liang, Shuang Xia, Shengtai Zhou, Huawei Zou · 发表于：Journal of Applied Polymer Science · 年份：2024 · DOI：10.1002/app.56099 · 被引用次数：6 · 研究领域：Thermal properties of materials、Dielectric materials and actuators、Graphene research and applications

Abstract In this paper, highly electrically and thermally conductive copper powders (Cu) and electrically insulative yet thermally conductive silicon carbide whiskers (SiCw) were selected as functional fillers and high‐density polyethylene (HDPE) was used as the matrix to prepare thermal conductive composites. By controlling the amount of Cu at 30 vol% which is below percolation threshold, the volume resistivity of the composites is maintained above 10 14 Ω cm. The results showed that SiCws entered the area which was not occupied by Cu particles and they played a bridging effect among Cu particles, thereby promoting the formation of intact thermal conductive pathways that contributed to improving the thermal conductivity of corresponding composites. The combination of SiCw:Cu = 3:1 at a filler content of 30 vol% resulted in a thermal conductivity as high as 1.921 W/mK, which is 380% higher than pure HDPE.