Timing resolution performance of Timepix4 bump-bonded assemblies

作者：R. Bolzonella, J. Alozy, R. Ballabriga, M. van Beuzekom, N. V. Biesuz, M. Campbell, P. Cardarelli, V. Cavallini, V. Coco, A. Cotta Ramusino, M. Fiorini, V. Gromov, M. Guarise, X. Llopart, S. Okamura, Gabriele Romolini, A. Saputi, A. Vitkovskiy · 发表于：Journal of Instrumentation · 年份：2024 · DOI：10.1088/1748-0221/19/07/p07021 · 被引用次数：10 · 研究领域：3D IC and TSV technologies、Interconnection Networks and Systems、CCD and CMOS Imaging Sensors

Abstract The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a 100 μ m thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole pairs in the silicon bulk in a repeatable fashion, controlling the amount, position and time of the stimulated charge signal. The timing resolution for a single pixel has been measured to 107 ps r.m.s. for laser-stimulated signals in the silicon sensor bulk. Considering multi-pixel clusters, the measured timing resolution reached 33 ps r.m.s. exploiting oversampling of the timing information over several pixels.