Electrothermal Transient Co-Simulation With Domain Decomposition Method for 3-D Complex Integrated Systems

作者：Qiuyue Wu, Yuan Xu, Na Liu, Mingwei Zhuang, Qing Liu · 发表于：IEEE Transactions on Components Packaging and Manufacturing Technology · 年份：2024 · DOI：10.1109/tcpmt.2024.3428478 · 被引用次数：4 · 研究领域：Semiconductor materials and devices、Silicon Carbide Semiconductor Technologies、3D IC and TSV technologies

In the field of modern electronics engineering, the analysis of electrothermal coupling in multiscale electronic devices is increasingly complex, demanding more computational resources and presenting challenges in rapid convergence. This complexity is further heightened by the continuous evolution of integrated circuit (IC) packaging technologies. Recognizing these challenges, this study introduces a new domain decomposition method (DDM) specifically engineered to address transient electrothermal coupling analysis in such environments. The proposed DDM can utilize meshes with varying densities across different subdomains and employ nonconformal meshes at the interface. This method can optimize computational efficiency while ensuring simulation accuracy. The contribution lies in its ability to flexibly mesh the structure according to its characteristics and reduce the overall degrees of freedom (DoFs). Representative examples are used for a series of tests in modern ICs. The results demonstrate not only the accuracy but also the efficiency in handling intricate electrothermal coupling problems. In the context of escalating multiscale integration complexities, the proposed DDM provides a powerful tool for engineers and designers to optimize device performance.