Understanding intermetallic compound growth at Ag/Zn interfaces: Kinetics and mechanisms

作者：O Minho, H Sakaguchi, Equo Kobayashi, Masanori Kajihara · 发表于：Intermetallics · 年份：2024 · DOI：10.1016/j.intermet.2024.108378 · 被引用次数：6 · 研究领域：Electronic Packaging and Soldering Technologies、Metallurgical and Alloy Processes、nanoparticles nucleation surface interactions

This study explores the growth behavior and rate-controlling processes of intermetallic compounds at Ag/Zn diffusion couple interfaces. Through experimental observations and quantitative analysis, we identify three distinct intermetallic compounds: β-AgZn, γ-Ag 5 Zn 8 , and ε-AgZn 3 . We analyze the kinetics of intermetallic compound growth to elucidate the mechanisms governing thickness growth in terms of interdiffusion and interface reactions. The rate-controlling process varies with temperature; volume diffusion controls layer growth at 573–593 K, while both volume diffusion and interface reaction contribute at 623–673 K. Additionally, we evaluate the activation enthalpies of parabolic coefficients, providing insights into the temperature dependence of growth kinetics and quantitation. This comprehensive analysis clarifies the intricate mechanisms underlying intermetallic compound formation, offering valuable implications for material performance and processing optimization in various applications. • We identified the formation of three intermetallic compounds (β-AgZn, γ-Ag 5 Zn 8 , ε-AgZn 3 ) at Ag/Zn interfaces. • The temperature dependence of the diffusion coefficient is higher compared to that of the interface reaction rate. • We evaluated activation enthalpies of parabolic coefficients for the growth, elucidating the temperature dependence. • Understanding the mechanisms governing intermetallic compound formation is crucial for material performance optimization.