Heterointerfacial adhesion failure mechanism of ultrahigh filler loading containing epoxy composite films for chip substrates

作者：Shanjun Ding, Xiao‐Meng Wu, Xu Zhang, Mengqi Gui, Zhidan Fang, Qidong Wang · 发表于：RSC Applied Interfaces · 年份：2024 · DOI：10.1039/d4lf00153b · 被引用次数：11 · 研究领域：Mechanical Behavior of Composites、Epoxy Resin Curing Processes

High adhesion force of chip substrates is crucial for improving chip reliability in the field of microelectronics.