Understanding interfacial compounds induced by Ag diffusion on improving interface electrical contact resistivity between the Cu electrode and Bi2Te3 thin film

作者：Zeyu Liu, Zeyu Liu, Limei Shen, Junhao Yan, Zun Liu, Zun Liu, Zhichun Liu, Zhichun Liu · 发表于：Journal of Alloys and Compounds · 年份：2024 · DOI：10.1016/j.jallcom.2024.175101 · 被引用次数：18 · 研究领域：Advanced Thermoelectric Materials and Devices、Electronic Packaging and Soldering Technologies、Surface and Thin Film Phenomena