Preparation of polyimide bond-linked covalent organic frameworks as resin-compatible nanofillers for copper clad laminates with improved thermal and electrical performances

作者：He Sun, Cheng Wang, Xiao Zhang, Fengwei Wang · 发表于：Journal of Materials Science · 年份：2024 · DOI：10.1007/s10853-024-09776-1 · 被引用次数：12 · 研究领域：Covalent Organic Framework Applications、Conducting polymers and applications、Advanced Photocatalysis Techniques