Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application

作者：Vance Liu, Yung-Sheng Zou, Yiyu Chen, Wan Ling Chang, Xue Qin Foo, Yijing Chen, Chien-Ming Chen, Min-Hua Chung, Chong Leong Gan · 发表于：Materials Science in Semiconductor Processing · 年份：2024 · DOI：10.1016/j.mssp.2024.108489 · 被引用次数：19 · 研究领域：Electronic Packaging and Soldering Technologies、3D IC and TSV technologies、Aluminum Alloys Composites Properties