Study on the design and fabrication of Silicon-Based integrated current sensor based on 3D Through-Silicon-Via (TSV) Rogowski coil

作者：Pan Xu, Ning An, Zhenzhong Yang, Yuexing Wang, Quanfeng Zhou, Shuairong Deng, Xiangyu Sun · 发表于：Measurement · 年份：2024 · DOI：10.1016/j.measurement.2024.114741 · 被引用次数：8 · 研究领域：Magnetic Field Sensors Techniques、Magneto-Optical Properties and Applications、Non-Destructive Testing Techniques