Low‐Cost Metallization Based on Ag/Cu Fingers for Exceeding 25% Efficiency in Industrial Silicon Heterojunction Solar Cells

作者：Daxue Du, Huanpei Huang, Xingbing Li, Sheng Ma, Dongming Zhao, Rui Li, Haiwei Huang, Zhidan Hao, Fanying Meng, Lin Li, Li He, Dong Ding, Zhengxin Liu, Wenbin Zhang, Wenzhong Shen · 发表于：Solar RRL · 年份：2024 · DOI：10.1002/solr.202400052 · 被引用次数：5 · 研究领域：Silicon and Solar Cell Technologies、Thin-Film Transistor Technologies、Semiconductor materials and interfaces

Although Ag‐coated Cu technology is considered to be an effective approach to mitigate the metallization expenses associated with silicon heterojunction (SHJ) solar cells, there is limited reporting on the photovoltaic performance and reliability of devices employing Ag/Cu electrodes. Herein, industrial SHJ solar cells were successfully fabricated, yielding an average efficiency of 25.18% with bifacial Ag/Cu fingers, which caused a 0.13% decline in efficiency but saved 46% in Ag consumption when compared to traditional Ag fingers. Performance degradation is demonstrated to originate essentially from the front rather than rear Ag/Cu fingers, as revealed by a comprehensive analysis of resistances enhancement and optical losses. Notably, the Ag/Cu fingers exhibited 1.4% lower printed qualification rate and similar high‐temperature stabilities in contrast to Ag fingers. In the results, valuable insights were provided for further optimization of low‐cost and high‐efficiency SHJ solar cells based on Ag/Cu electrodes.