The growth behavior and kinetics of intermetallic compounds in Cu–Al interface at 600°C–800 °C

作者：Dandan Zhao, Weijia Guo, Zhichao Shang, Chengyi Xu, Xinran Gao, Xiaohong Wang · 发表于：Intermetallics · 年份：2024 · DOI：10.1016/j.intermet.2024.108244 · 被引用次数：36 · 研究领域：Aluminum Alloys Composites Properties、Aluminum Alloy Microstructure Properties、Microstructure and mechanical properties