Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging

作者：Yuanming Chen, Junjie Huang, Yunzhong Huang, Qingyuan Li, Hong Zeng, Ling Tian, Jingsong Li, Shouxu Wang, Wei He, Yan Hong · 发表于：Journal of Materials Science Materials in Electronics · 年份：2024 · DOI：10.1007/s10854-024-12043-3 · 被引用次数：7 · 研究领域：Electronic Packaging and Soldering Technologies、Metallurgical and Alloy Processes、Intermetallics and Advanced Alloy Properties