Study on the affecting factors of material removal mechanism and damage behavior of shear rheological polishing of single crystal silicon carbide

作者：Hongyu Chen, Zhengchao Wu, Binbin Hong, Wei Hang, Peng Zhang, Xingzhong Cao, Qiu Xu, Pengqi Chen, Heng Chen, Julong Yuan, Binghai Lyu, Hua‐Tay Lin · 发表于：Journal of Manufacturing Processes · 年份：2024 · DOI：10.1016/j.jmapro.2024.01.040 · 被引用次数：75 · 研究领域：Advanced Surface Polishing Techniques、Diamond and Carbon-based Materials Research、Silicon Carbide Semiconductor Technologies