Interfacial behavior of a thermoelectric film bonded to a graded substrate

作者：Juan Peng, Dengke Li, Zaixing Huang, Guangjian Peng, Peijian Chen, Shaohua Chen · 发表于：Applied Mathematics and Mechanics · 年份：2023 · DOI：10.1007/s10483-023-3045-8 · 被引用次数：13 · 研究领域：Advanced Thermoelectric Materials and Devices、Thermal properties of materials、Electronic Packaging and Soldering Technologies