Reinforcing bond covalency for high thermoelectric performance in Cu3SbSe4-based thermoelectric material

作者：Dan Zhang, Ruiqi Zhong, Shikang Gao, Lei Yang, Fang Xu, Ping He, Guannan Liu, Xingyuan San, Junyou Yang, Yubo Luo, Shufang Wang · 发表于：Science China Materials · 年份：2023 · DOI：10.1007/s40843-023-2498-y · 被引用次数：19 · 研究领域：Advanced Thermoelectric Materials and Devices、Thermal properties of materials、Perovskite Materials and Applications