Plasma-activated silicon–glass high-strength multistep bonding for low-temperature vacuum packaging

作者：Mingzhi Yu, Libo Zhao, Yongliang Wang, Yongliang Wang, Yong Xia, Yintao Ma, Yanbin Wang, Yanbin Wang, Xiangguang Han, Yao Chen, Shun Lu, Guoxi Luo, Nan Zhu, Ping Yang, Kaifei Wang, Qijing Lin, Zhuangde Jiang · 发表于：Chemical Engineering Journal · 年份：2023 · DOI：10.1016/j.cej.2023.144719 · 被引用次数：23 · 研究领域：3D IC and TSV technologies、Electronic Packaging and Soldering Technologies、Advanced MEMS and NEMS Technologies