Numerical study on thermal and hydraulic performances of a hybrid manifold microchannel with bifurcations for electronics cooling

作者：Jingshan Yang, Keyong Cheng, Kai Zhang, Caifeng Huang, Xiulan Huai · 发表于：Applied Thermal Engineering · 年份：2023 · DOI：10.1016/j.applthermaleng.2023.121099 · 被引用次数：35 · 研究领域：Heat Transfer and Optimization、Heat Transfer Mechanisms、Nanofluid Flow and Heat Transfer