Challenges and prospects for advanced packaging

作者：Zhiwen Chen, J. Zhang, Shizhao Wang, Ching‐Ping Wong · 发表于：Fundamental Research · 年份：2023 · DOI：10.1016/j.fmre.2023.04.014 · 被引用次数：140 · 研究领域：Electronic Packaging and Soldering Technologies、3D IC and TSV technologies、Additive Manufacturing and 3D Printing Technologies

In the post-Moore era, advanced packaging is becoming more critical to meet the everlasting demands of electronic products with smaller size, more powerful performance and lower cost. In this paper, developments in advanced packaging have been discussed, such as 3D IC packaging, fan-out packaging, and chiplet packaging. Insights on the major advantages and challenges have also been briefly introduced. Our prospects about the solutions to some fundamental issues in sustainable development of advanced packaging have also been elucidated. The critical aspects and opportunities lie in standardization, co-design tools, new handling technologies, as well as multi-scale modeling and simulation.