Insights into the synergistic effects of safranine in an acidic copper bath on through-hole void-free filling for high-quality electronics interconnection

作者：Lei Jin, An-Ni Zheng, Mei Wang, Jiaqiang Yang, Zhao-Yun Wang, Zhao-Yun Wang, Fang-Zu Yang, De‐Yin Wu, Dongping Zhan · 发表于：Colloids and Surfaces A Physicochemical and Engineering Aspects · 年份：2023 · DOI：10.1016/j.colsurfa.2023.131706 · 被引用次数：10 · 研究领域：Electrodeposition and Electroless Coatings、Electrochemical Analysis and Applications、Copper Interconnects and Reliability