Review of ultrasonic-assisted soldering in Sn-based solder alloys

作者：Chen Chen, Liang Zhang, Xi Wang, Xiao Lu, Lili Gao, Meng Zhao, Sujuan Zhong · 发表于：Journal of Materials Science Materials in Electronics · 年份：2023 · DOI：10.1007/s10854-023-10063-z · 被引用次数：19 · 研究领域：Electronic Packaging and Soldering Technologies、Advanced Welding Techniques Analysis、3D IC and TSV technologies