The interfacial behavior of a thermoelectric thin-film bonded to an orthotropic substrate

作者：Dengke Li, Peijian Chen, Zaixing Huang, Hao Liu, Shaohua Chen · 发表于：International Journal of Solids and Structures · 年份：2023 · DOI：10.1016/j.ijsolstr.2023.112160 · 被引用次数：24 · 研究领域：Electronic Packaging and Soldering Technologies、Advanced Thermoelectric Materials and Devices、Advanced Welding Techniques Analysis